We invite you to an exclusive two‑day Hands-On Thermogravimetric Analysis (TGA) and Rheometer Workshop, designed to give participants both theoretical understanding and practical, application-focused experience. Unlike typical training sessions, this workshop allows you to bring your own samples and evaluate them directly using NETZSCH instruments.

Why Attend?

This workshop is crafted for researchers, laboratory personnel, and industry professionals who want to deepen their understanding of thermal analysis and rheology while solving real challenges from their daily workflow.

By joining us, you will be able to:

• Gain insights into your materials’ behavior under actual measurement conditions
• Troubleshoot common testing issues with guidance from application specialists
• Enhance your testing workflow through best practices and expert tips
• Experience NETZSCH TGA and Rheometer systems on your own samples

Workshop Details

Date: 15–16 April 2026
Time: 9:30 AM – 4:00 PM
Venue: Universiti Sains Malaysia (USM), School of Industrial Technology, 1st Floor, Seminar Room 171

What’s Included:

• Theory sessions
• Application discussions
• Complimentary sample testing using NETZSCH instruments

Registration

Seats are limited and allocated on a first‑come, first‑served basis.
Register now: https://lnkd.in/guKKKXhp