List of Industries
ADVANCED SOLUTIONS FOR SEMICONDUCTOR
The semiconductor industry is a crucial part of the modern world, providing the backbone for the digital devices we use every day. However, the quality and performance of these devices depend on the materials and manufacturing processes used in the semiconductor industry. As a result, there is a constant need for quality assurance to ensure that these products meet the highest standards.
As a one-stop solution provider for the semiconductor industry, we offer a comprehensive range of products to semiconductor manufacturers. By working with us, semiconductor manufacturers can benefit from a holistic approach to their operations, streamlining their processes, and improving the quality and performance of their products. Our team of experts stays on top of the latest developments in semiconductor technology to ensure we provide the most innovative and effective solutions to our customers.
INCOMING RAW MATERIAL
Fourier Transform Infrared Spectrometer (FTIR)
~ Identify the foreign material (bulk sample analysis) present, chemical type.
~ Ensuring the quality of raw materials used in Printed Circuit Boards (PCBs) meet the requirement standards.
~ Checking the Curing Status in Electronic Packaging as uncured process could lead to failure.
~ Analysis of Specialty Gases
Fourier Transform Near-Infrared Spectroscopy (FT-NIR)
~ Quick analysis to measure the hydrogen peroxide (oxidizer) level in the Chemical Mechanical Planarization (CMP) Slurry
Dynamic Mechanical Analyzer (DMA)
~ A very sensitive technique to obtain the Electronic Boards glass transition temperature (Tg), Storage Modulus & Loss Modulus
Thermomechanical Analyzer (TMA)
~ Checking the coefficient of thermal expansion (CTE) in Underfill materials to minimize the CTE mismatch between chips and the printed circuit boards (PCBs). Also to measure the glass transition temperature (Tg) for the substrates.
Thermogravimetric Analyzer (TGA)
~ Checking the thermal stability of the materials and also the compositional analysis.
Differential Scanning Calorimeter (DSC)
~ Measure the thermal transition such as melting, glass transition & crystallization. Also used to check the degree of curing for the thermosets material in the PCBs underfill.
~Checking the coefficient of thermal expansion (CTE) and glass transition temperature of electronic Circuit Boards substrate
~ The contact angle measurement, surface tension of liquid, surface free energy of substrate are critical to determine the wetting capability of the solution to a substrate such as sensors.
QA/QC MATERIAL CHARACTERISATION
(10 micron spatial resolution)
~ Typically used in the Failure Analysis departments to identify organic contaminations found in the Electronic Packaging, PCB and Displays, either in form of powders/ stains/ foreign particles down to 10 micron size.
(1 micron spatial resolution)
~ Typically used in the Failure Analysis departments to identify Inorganic contaminations found in the Electronic Packaging, PCB and Displays.
~ Analyzing the orientation of screen Protective film by polarized raman.
Nano IR Microscope (20 nm spatial resolution)
~ Nano-FTIR spectroscopy performing infrared imaging for chemical identification down to 10nm, and is suited for all classes materials-organics & inorganics
Products & Solutions
Thermal & Thermophyscial Analysis
High Performance Thin Layer Chromatography
Material / Physical Testing
Food Quality Testing
Measuring Extruders & Mixers
Viscometry, Tensiometry & Surface Analyzer System
Mercury, Arsenic & Selenium Analyzer